| RoHS Compliance |  |
ROHM's current lead-free products, including ICs, semiconductors and passive device products, comply with the WEEE*1 (Waste Electrical and Electronic Equipment) and the RoHS*2 (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) directives issued in Europe. ROHM products do not contain substances banned under the RoHS directive (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers).
ROHM is now equipped with an inductively coupled plasma atomic absorption spectrometer for detailed element analysis of metals and other elements. The spectrometer enables us to verify that products do not contain banned substances (lead, mercury, cadmium, and hexavalent chromium), whether produced by ROHM or purchased from a supplier. Products are certified free of polybrominated biphenyls and polybrominated diphenyl ethers after analysis by external public laboratories. New equipment at key production facilities and the QA Center allows ROHM to verify the levels of other various chemical substances in purchased materials, parts, and products using fluorescent X-ray analysis.
Efforts to comply with the RoHS directive
The WEEE directive will become effective on July 1, 2006 in Europe. The WEEE directive, however, does not specify restricted substances and their allowable usage amounts. These specifics are included in the RoHS directive which also becomes effective on July 1, 2006. As of today, all of the substances covered by the RoHS directive (except lead) have been eliminated from ROHM products. ROHM products will be in compliance with the entire RoHS directive once lead is eliminated.
The RoHS directive will become effective on July 1, 2006. As a preparation for complying with this directive, ROHM started a lead-free project for developing technologies in June 1997, which was one year before the first draft of the WEEE directive was issued. Lead-free technologies for discrete semiconductor devices and passive devices were developed and completed in 2000. In 2001, lead-free technologies for terminals and electrodes of ICs were successfully developed. Mass production of RoHS-compliant ICs, transistors and diodes was started in December 2001. In May 2004, following two and a half years of test and evaluation of the quality and reliability of the lead-free technologies, ROHM has developed lead-free ICs, discrete semiconductors and passive devices which are to be capable of full compliance with the RoHS directive. |
RoHS Search
Read about ROHM's RoHS compliant products (FAQ) |
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Ensuring coexistence with the global environment
Lead-free Products,
RoHS Compliant. |
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RoHS Statement
All* ROHM products
are RoHS-compliant.
* Except for certain customized products specifically requested by customers
ROHM ensures that the performance of its lead-free (external terminal) products is equal or superior to conventional products in terms of both solderability and junction reliability due to a lower melting point, improved wettability, and optimization of metallic characteristics. In addition, mountability, reliability, strength, and heat resistance are ensured, even when mounted using lead-free solder. |
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