Features
1. ROHM original compact high power package (4.5×4.0×1.0mm,PD2.0W)
2. Same package power as conventional SOP8 packages
(5.0×6.0×1.75mm),but in a form factor 40% smaller and 43% thinner
3. Ideal replacement for dual-element SOP8 packages rated at ID6A or less
4. Novel manufacturing
5. New element construction utilized for low ON resistance
6. Compact, space-saving package contributes to board miniaturization